<\/p>\n\n\n\n
HSINCHU, Taiwan \/ PENANG, Malaysia, Feb 9 (Bernama) — Chipbond Technology Corporation, a leading global provider of semiconductor packaging and testing services, today marked the official opening of its new advanced manufacturing facility, Chipbond Technology Malaysia Sdn. Bhd., located in Valdor Industrial Park, Batu Kawan, Penang, Malaysia. <\/p>\n\n\n\n
The establishment of the facility represents a significant milestone in Chipbond\u2019s global expansion strategy, with a total investment of close to US$200 million (approximately RM800 million). The new plant strengthens Malaysia\u2019s position within the global outsourced semiconductor assembly and test (OSAT) value chain, while reinforcing Malaysia\u2019s role as a key hub for advanced semiconductor manufacturing.<\/p>\n\n\n\n
Highlighting the broader impact of the project, Datuk Sikh Shamsul Ibrahim Sikh Abdul Majid, Chief Executive Officer of the Malaysian Investment Development Authority (MIDA), said, \u201cThis facility represents a new investment that contributes to the expansion of Malaysia\u2019s OSAT capacity and ecosystem while further strengthening the nation\u2019s semiconductor competitiveness. It brings deeper integration, technology transfer, and the building of local capabilities that will benefit Malaysia’s semiconductor ecosystem for years to come. Chipbond is bringing advanced OSAT expertise in wafer bumping and chip-scale packaging that requires highly skilled engineers. Your commitment to structured training programmes and university collaborations will equip Malaysians with the skills needed for complex, high-value semiconductor production. With companies like Chipbond anchoring advanced capabilities here, Malaysia is building an integrated semiconductor ecosystem where local talent and SMEs can participate meaningfully in global value chains.\u201d<\/p>\n\n\n\n
Dato\u2019 Loo Lee Lian, Chief Executive Officer of InvestPenang (representing the Right Honourable Mr. Chow Kon Yeow, Chief Minister of Penang), stated, \u201cBacked by more than 50 years of industrialisation and a strong foundation in OSAT, Penang has built a mature ecosystem, a skilled talent base, and a conducive business environment. Investments such as Chipbond\u2019s are strategic in driving Penang\u2019s shift towards advanced packaging and innovation-led growth and aligning with the National Semiconductor Strategy (NSS). We look forward to seeing strong knowledge transfer, talent upskilling, and deeper collaboration, further strengthening Penang\u2019s position as a regional hub for advanced semiconductor packaging.\u201d<\/p>\n\n\n\n
Mr. Wu Fei Jain, Chipbond Chairman, emphasised, \u201cThis new facility represents Chipbond\u2019s commitment in expanding our global footprint and assuring customers of stable and continuous supply. Without the supports of Malaysia government, contributions of our customers and the tireless dedications of Chipbond teams, we would not be able to achieve this challenging goal within such a compressed time frame.\u201d<\/p>\n\n\n\n
The Penang facility will offer advanced semiconductor processes, including advanced wafer bumping, wafer-level chip-scale packaging (WLCSP) and testing, with an initial capacity of 10,000 wafers and 100 million WLCSP unites per month. The plant is also equipped to support flip-chip packaging assembly and test, providing flexibility for future technology and customer requirements. Internal qualification of the facility is scheduled for completion by the end of 2025, with customer qualification commencing in the first quarter of 2026.<\/p>\n\n\n\n
The establishment of Chipbond Technology Malaysia Sdn. Bhd. underscores Malaysia\u2019s continued attractiveness to global semiconductor players and highlights the country\u2019s growing role in supporting resilient, high-value and innovation-driven semiconductor supply chains.<\/p>\n","protected":false},"excerpt":{"rendered":"
HSINCHU, Taiwan \/ PENANG, Malaysia, Feb 9 (Bernama) — Chipbond Technology Corporation, a leading global provider of semiconductor packaging and testing services, today marked the official opening of its new advanced manufacturing facility, Chipbond Technology Malaysia Sdn. Bhd., located in Valdor Industrial Park, Batu Kawan, Penang, Malaysia. The establishment of the facility represents a significant milestone […]<\/p>\n","protected":false},"author":5,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[24,34],"tags":[],"class_list":["post-6748","post","type-post","status-publish","format-standard","hentry","category-business","category-general"],"_links":{"self":[{"href":"https:\/\/malaysian-business.com\/portal\/wp-json\/wp\/v2\/posts\/6748","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/malaysian-business.com\/portal\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/malaysian-business.com\/portal\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/malaysian-business.com\/portal\/wp-json\/wp\/v2\/users\/5"}],"replies":[{"embeddable":true,"href":"https:\/\/malaysian-business.com\/portal\/wp-json\/wp\/v2\/comments?post=6748"}],"version-history":[{"count":1,"href":"https:\/\/malaysian-business.com\/portal\/wp-json\/wp\/v2\/posts\/6748\/revisions"}],"predecessor-version":[{"id":6749,"href":"https:\/\/malaysian-business.com\/portal\/wp-json\/wp\/v2\/posts\/6748\/revisions\/6749"}],"wp:attachment":[{"href":"https:\/\/malaysian-business.com\/portal\/wp-json\/wp\/v2\/media?parent=6748"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/malaysian-business.com\/portal\/wp-json\/wp\/v2\/categories?post=6748"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/malaysian-business.com\/portal\/wp-json\/wp\/v2\/tags?post=6748"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}